PROCEEDINGS OF SPIE. Event: SPIE OPTO, 2012, San Francisco, California, United States

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1 PROCEEDINGS OF SPIE SPIEDigitalLibrary.org/conference-proceedings-of-spie Front Matter: Volume 8265, "Front Matter: Volume 8265," Proc. SPIE 8265, Optoelectronic Integrated Circuits XIV, (6 March 2012); doi: / Event: SPIE OPTO, 2012, San Francisco, California, United States

2 PROCEEDINGS OF SPIE Optoelectronic Integrated Circuits XIV Louay A. Eldada El-Hang Lee Editors January 2012 San Francisco, California, United States Sponsored and Published by SPIE Volume 8265 Proceedings of SPIE, X, v SPIE is an international society advancing an interdisciplinary approach to the science and application of light.

3 The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from this book: Author(s), "Title of Paper," in Optoelectronic Integrated Circuits XIV, edited by Louay A. Eldada, El-Hang Lee, Proceedings of SPIE Vol (SPIE, Bellingham, WA, 2012) Article CID Number. ISSN X ISBN Published by SPIE P.O. Box 10, Bellingham, Washington USA Telephone (Pacific Time) Fax SPIE.org Copyright 2012, Society of Photo-Optical Instrumentation Engineers Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is X/12/$ Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library. SPIEDigitalLibrary.org Paper Numbering: Proceedings of SPIE follow an e-first publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which: The first four digits correspond to the SPIE volume number. The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B 0Z, followed by 10-1Z, 20-2Z, etc. The CID number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. Numbers in the index correspond to the last two digits of the six-digit CID number.

4 Contents vii Conference Committee ix Spinoptics: Spin degeneracy removal in nanostructures (Plenary Paper) [ ] V. Kleiner, N. Shitrit, E. Hasman, Technion-Israel Institute of Technology (Israel) OPTICAL INTERCONNECTS IN HIGH PERFORMANCE COMPUTING: JOINT SESSION WITH CONFERENCE Multicore fiber link demonstrating large bandwidth density for future multimode optical interconnects (Invited Paper) [ ] B. G. Lee, C. Baks, F. E. Doany, D. M. Kuchta, P. Pepeljugoski, C. L. Schow, IBM Thomas J. Watson Research Ctr. (United States) NANOPHOTONICS FOR OPTICAL INTERCONNECTS: JOINT SESSION WITH CONFERENCE Multiprocessor silicon photonic interconnects: a systems perspective (Invited Paper) [ ] P. Koka, M. O. McCracken, H. Schwetman, X. Zheng, R. Ho, J. Yao, J. G. Mitchell, K. Raj, A. V. Krishnamoorthy, Oracle (United States) SILICON OEICS I Advanced silicon device technologies for optical interconnects (Invited Paper) [ ] L. Wosinski, Royal Institute of Technology (Sweden) and Joint Research Ctr. of Photonics of the Royal Institute of Technology and Zhejiang Univ. (China); Z. Wang, Univ. Gent (Belgium); F. Lou, Royal Institute of Technology (Sweden); D. Dai, Joint Research Ctr. of Photonics of the Royal Institute of Technology and Zhejiang Univ. (China) and Zhejiang Univ. (China); S. Lourdudoss, Royal Institute of Technology (Sweden); L. Thylen, Royal Institute of Technology (Sweden) and Joint Research Ctr. of Photonics of the Royal Institute of Technology and Zhejiang Univ. (China) Recent advances in manufactured silicon photonics (Invited Paper) [ ] D. Feng, B. J. Luff, M. Asghari, Kotura, Inc. (United States) VLSI PHOTONICS A Scaling CMOS photonics transceivers beyond 100 Gb/s (Invited Paper) [ ] A. Mekis, S. Abdalla, P. M. De Dobbelaere, D. Foltz, S. Gloeckner, S. Hovey, S. Jackson, Y. Liang, M. Mack, G. Masini, R. Novais, M. Peterson, T. Pinguet, S. Sahni, J. Schramm, M. Sharp, D. Song, B. P. Welch, K. Yokoyama, S. Yu, Luxtera (United States) iii

5 8265 0C Chip-scale demonstration of 3D integrated intrachip free-space optical interconnect (Invited Paper) [ ] H. Wu, B. Ciftcioglu, Univ. of Rochester (United States); R. Berman, Institute of Optics, Univ. of Rochester (United States); J. Hu, S. Wang, I. Savidis, Univ. of Rochester (United States); M. Jain, D. Moore, Institute of Optics, Univ. of Rochester (United States); M. Huang, E. G. Friedman, Univ. of Rochester (United States); G. Wicks, Institute of Optics, Univ. of Rochester (United States) D Low-loss photonic wires defined by local oxidation of silicon (LOCOS) [ ] Y. Xiong, M. Ibrahim, W. N. Ye, Carleton Univ. (Canada) NANOSCALE AND QUANTUM OEICS E Nanophotonics for datacom and telecom applications (Invited Paper) [ ] D. Bimberg, D. Arsenijevic, H. Schmeckebier, C. Meuer, G. Fiol, Technische Univ. Berlin (Germany); G. Eisenstein, Technion-Israel Institute of Technology (Israel) G Identification of localized group-velocity dispersion of nanostructured silicon waveguide devices using white-light interferometry (Invited Paper) [ ] K. H. Kim, S. H. Kim, D. W. Kim, S. H. Lee, E.-H. Lee, Inha Univ. (Korea, Republic of) TRENDS IN OEICS I Light guidance through void: silicon slot waveguides and their rigorous characterization (Invited Paper) [ ] B. M. A. Rahman, D. M. H. Leung, S. N. Ahsan, P. Tan, K. T. V. Grattan, The City Univ. (United Kingdom) J A speckle-based CMOS sensor for arbitrary surface movement detection with correlated double sampling and gain error correction [ ] C. Wang, S. Tanner, P.-A. Farine, Ecole Polytechnique Fédérale de Lausanne (Switzerland) K Time-and-frequency-domain modeling (TFDM) of hybrid photonic integrated circuits (Invited Paper) [ ] C. Arellano, VPIsystems GmbH (Germany); S. F. Mingaleev, E. Sokolov, VPI Development Ctr. (Belarus); I. Koltchanov, A. Richter, VPIsystems GmbH (Germany) L Integrated silicon photonic nanocircuits and technologies for optical interconnect and optical sensing (Invited Paper) [ ] D. Dai, S. He, Zhejiang Univ. (China) and Joint Research Ctr. of Photonics of the Royal Institute of Technology and Zhejiang Univ. (China) iv

6 POSTER SESSION N Integration of 3D plasmonic devices with silicon-on-insulator-based optical circuitry [ ] R. Yang, Z. Lu, Rochester Institute of Technology (United States) Author Index v

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8 Conference Committee Symposium Chair Klaus P. Streubel, OSRAM GmbH (Germany) Symposium Cochairs David L. Andrews, University of East Anglia Norwich (United Kingdom) Liang-Chy Chien, Kent State University (United States) Program Track Chair Yakov Sidorin, Quarles Brady LLP (United States) Conference Chairs Louay A. Eldada, SunEdison (United States) El-Hang Lee, Inha University (Korea, Republic of) Program Committee Yung-Jui Chen, University of Maryland, Baltimore County (United States) Larry A. Coldren, University of California, Santa Barbara (United States) Mario Dagenais, University of Maryland, College Park (United States) P. Daniel Dapkus, The University of Southern California (United States) Yeshaiahu Fainman, University of California, San Diego (United States) Chennupati Jagadish, The Australian National University (Australia) Richard M. Osgood, Jr., Columbia University (United States) Manijeh Razeghi, Northwestern University (United States) Giancarlo C. Righini, Istituto di Fisica Applicata Nello Carrara (Italy) David J. Rogers, Nanovation (France) and University of St. Andrews (United Kingdom) Session Chairs 1 Optical Interconnects in High Performance Computing: Joint Session with Conference 8267 Louay A. Eldada, SunEdison (United States) 2 Nanophotonics for Optical Interconnects: Joint Session with Conference 8267 Ray T. Chen, The University of Texas at Austin (United States) vii

9 3 Silicon OEICs I El-Hang Lee, Inha University (Korea, Republic of) 4 Silicon OEICs II El-Hang Lee, Inha University (Korea, Republic of) 5 VLSI Photonics El-Hang Lee, Inha University (Korea, Republic of) 6 Nanoscale and Quantum OEICs Louay A. Eldada, SunEdison (United States) 7 Trends in OEICs Kyong-Hon Kim, Inha University (Korea, Republic of) viii