Intel Realsense D435 3D Active IR Stereo Depth Camera
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1 Intel Realsense D435 3D Active IR Stereo Depth Camera System report by David Le Gac May by System Plus Consulting Intel RealSense D435 1
2 Table of Contents o Executive Summary o Main Chipset o Company Profile : Intel o Reverse Costing Methodology Teardown Analysis o Views and Dimensions of the System o System Opening (Step by Step Teardown) o MCU Board Top Side Global view Top Side High definition photo Top Side Main components markings Top Side Main components identification Bottom Side Global view o Sensors Board Top Side Global view Top Side High definition photo Top Side Main components markings Top Side Main components identification o Dies view o Sensors Board Cross section o Lens Modules Cross sections o Accessing the BOM o PCBs Cross Sections and o OmnivisionOV9282 CIS Die pictures and Cost estimation o VCSEL Die pictures, cross section and Cost estimation o of the cost of the Lens Module o BOM Cost - MCU Board o BOM Cost - Sensors Board o BOM Cost - Housing o Material Cost Breakdown o Accessing the Added Value (AV) cost o MCU Board Manufacturing Flow and Added Value Cost o Sensors Board Manufacturing Flow and Added Value Cost o Details of the System Assembly AV Cost o Added-Value Cost Breakdown o Manufacturing Cost Breakdown Estimated Price Analysis o of the 2018 by System Plus Consulting Intel RealSense D435 2
3 Reverse Costing Methodology o Executive Summary o Reverse Costing Methodology The reverse costing analysis is conducted in several phases: The initialization of the analysis Pictures of the elements to be studied. Identification of the components. Description of the material in the SYScost+ software Creation of an estimation project of the studied board with SYScost+ software. Construction of the Bill of Material (BOM). Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. Production cost & selling price of the production cost & selling price. Report A report is edited. SYS.cost+, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at by System Plus Consulting Intel RealSense D435 3
4 Global View of the D435 Total Weight: 68g o Views & Dimensions o Camera Opening o Electronic Boards o Dies view o Cross sections Global view of the D by System Plus Consulting Intel RealSense D435 4
5 Sensors Board Top Side Global View o Views & Dimensions o Camera Opening o Electronic Boards o Dies view o Cross sections 2018 by System Plus Consulting Intel RealSense D435 5
6 Sensors Board Top Side Main Components Identification o Views & Dimensions o Camera Opening o Electronic Boards o Dies view o Cross sections 2018 by System Plus Consulting Intel RealSense D435 6
7 Dies View o Views & Dimensions o Camera Opening o Electronic Boards o Dies view o Cross sections 2018 by System Plus Consulting Intel RealSense D435 7
8 Sensors Board cross section o Views & Dimensions o Camera Opening o Electronic Boards o Dies view o Cross sections 2018 by System Plus Consulting Intel RealSense D435 8
9 of the cost of the Intel D4 Vision Processor o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 9
10 of the cost of the Omnivision OV9282 CIS o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 10
11 of the cost of the VCSEL o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 11
12 of the cost of the VCSEL o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 12
13 BOM Cost MCU Board o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 13
14 Manufacturing Cost Breakdown o Accessing the BOM o PCB Cost o Vision Processor Cost o Sensors and VCSEL Cost o BOM Cost Electronics o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Breakdown 2018 by System Plus Consulting Intel RealSense D435 14
15 of the o Financial Ratios o 2018 by System Plus Consulting Intel RealSense D435 15
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